TSOP(Thin Small Outline Package)

situation

In the 80 s, the memory of the second generation of packaging technology TSOP appear, obtained the field wide acceptance, today is still a memory chip mainstream technological. TSOP(Thin Small Outline Package) Memory is in chips make pins, using around SMT technology (surface installation technology) attached to the PCB directly the surface. TSOP packaging shape dimension, parasitic parameters (current, cause large variation output voltage disturbance, suitable for high frequency decrease) application, the operation is more convenient, has a high reliability. At the same time TSOP packaging has high yield, as well as the low price advantage, so it has been extremely extensive application.


Chromatography discrimination

TSOP encapsulation way, the memory chip is through the chip pins in PCB board of welding, solder joints and PCB contact area is lesser, make the chip to heat transfer is relatively difficult PCB. And TSOP encapsulation methods exist inside of more than 150 MHz, and after the product larger signal interference and electromagnetic interference.

Small on both sides of the gulls wing feet out "IC" (SOIC), the number of feet about 20 ~ 48 feet, including feet, width of 6 ~ 12 mm, from 0.5 feet if used for PCMCIA mil-Holding up or other type of electronic products, it will further the thickness of thinning, called TSOP. Half the, thin and small double row feet IC can be divided into two type; Ⅰ by two short side reaches outward from the feet, Ⅱ by two long side reaches outward from the feet.