The so-called "encapsulation technology" is a kind of integrated circuit with insulating will of plastic or ceramic materials packaging technology. With the CPU, for example, the actual see size and appearance isn't real CPU kernel size and appearance, but the CPU core components after packaging products. Packaging technology is a must for chip encapsulation, also is crucial. Because chips must with the outside world, to prevent the air isolation of the circuit chip impurity to corrosion in electric performance decline. On the other hand, encapsulation and easier to the chip after installation and transport. Due to the stand or fall of encapsulation technology also directly affect the chip itself performance play and the connection of printed circuit board (PCB) design and manufacturing, so it is of vital importance.
Packaging technology
Encapsulation also say, is refers to install semiconductor integrated circuit chips with shell, it not only plays placed, fixed, sealing, protect chips and enhance the role of thermal conductivity, and still communicate with an external circuit chip the inner world of bridge - chip contacts with wires connected to encapsulate shell pins, these pins and through printed circuit boards wire connection is established with other devices. Therefore, for many integrated circuit product, encapsulation technology is very crucial one annulus.
Using CPU encapsulation are use insulation plastic or ceramic material packing up, can play the sealing and improve performance function. Chip electrothermal Now the processor chips in frequency more and more high, function is more and more strong, pin number is more and more, encapsulation appearance also constantly changing.
Packaging technology
Encapsulation also say, is refers to install semiconductor integrated circuit chips with shell, it not only plays placed, fixed, sealing, protect chips and enhance the role of thermal conductivity, and still communicate with an external circuit chip the inner world of bridge - chip contacts with wires connected to encapsulate shell pins, these pins and through printed circuit boards wire connection is established with other devices. Therefore, for many integrated circuit product, encapsulation technology is very crucial one annulus.
Using CPU encapsulation are use insulation plastic or ceramic material packing up, can play the sealing and improve performance function. Chip electrothermal Now the processor chips in frequency more and more high, function is more and more strong, pin number is more and more, encapsulation appearance also constantly changing.
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